Over Euro 250mn planned for new manufacturing facilities
In a move to combat the ongoing global chip shortage, Bosch plans to further extend its wafer fab in Reutlingen, Germany.
More than a quarter of a billion euros is to be invested in creating new production space and the necessary clean-room facilities between now and 2025. This will give Bosch the firepower to meet the continuously growing demand for chips used in mobility and IoT applications.
“We are systematically expanding our manufacturing capacity for semiconductors in Reutlingen,” commented Dr. Stefan Hartung, Chairman of the Board of Management, Robert Bosch.
“This new investment will not only strengthen our competitive position but will also benefit our customers and help combat the crisis in the semiconductor supply chain,” he continued.
The construction of a new extension in Reutlingen will create an additional 3,600sqm of ultramodern clean-room space. As of 2025, this additional capacity will produce semiconductors based on technology already in place at the Reutlingen plant.
Bosch is also extending an existing power supply facility and will construct an additional building for media supply systems serving both the new and existing production areas. The new production area is scheduled to go into operation in 2025.
“AI methods combined with connectivity have helped us achieve continuous, data-driven improvement in manufacturing and thereby produce better and better chips,” remarked Markus Heyn, Member of the Board of Management of Robert Bosch and Chairman of the Mobility Solutions Business Sector. The further expansion of the Reutlingen site will primarily serve the growing demand for microelectromechanical systems (MEMS sensors), in the automotive and consumer sectors and for silicon-carbide power semiconductors.